The factory will not do all 4000 at once, even if they had absolutely every part in front of them. This is a brand new design using technology that still isn't adopted by all assemblers. That is the POP design. Also, the 0.4mm pitched parts tends to cause troubles and requires very specific and repeated procedures to be followed to guarantee success. Basically, we have to do this in small runs. I tested a few boards of the new design, then batches get larger like 20 boards then 100, then 400 and then maybe the balance but the procedure has to be nailed down before they will pump out thousands.
Unfortunately, right now I am seeing a failure rate of at least 25%. That doesn't really scare me as it doesn't mean the boards are junked. It just means the stencil thickness, reflow oven temperature profile and dwell times and maybe even the visual inspection stages have not been tweaked yet. Reflowing the boards and doing some touch ups brings them back to life and then they work fine. They just have to keep trying things slowly and figure out all the tough areas so that those get extra attention and the areas of the boards that never fail can get a quick inspection. A final burn in test of each board will confirm that everything works.
We need to get the failure rate down to about 3% to get production going full speed. The manual labor on patching or re-running 3000 boards is financial suicide so you can see why things are not going as we would have liked. The biggest mistake any manufacturer can do is ship boards without feeling 100% confident in the hardware. It's common practice to use customers to test your beta software *cough* *Archos* *cough* but never to test hardware.
The other good news is that once this process is nailed down, we shouldn't see such headaches and delays for future batches. Everything is new right now and even though I have the most experience with this stuff in the group, I have never worked with such tiny, tiny little parts before. Going from 0.5mm to 0.4mm pitch BGA parts is a bigger leap than the numbers would suggest. Any fellow Engineers on the board might know what I'm talking about.

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